As data centers rapidly become AI factories, data center operators are exploring the challenges of how to upgrade their facilities for AI, including critical power and heat considerations. AI computing increases data center power and heat generation by 10 to 12 times, which makes state-of-the-art cooling technology an integral part of the AI-centric data center.
AIRSYS Cooling Technologies is addressing those challenges with liquid cooling solutions designed to optimize energy efficiency, reduce environmental impact, and ensure data centers are ready for the challenges and demands of AI computing. At Data Center World, Paul Quigley, president of AIRSYS Cooling Technologies, will present “Transforming Data Centers for AI — Without More Space or Power.”
In his presentation, Quigley will address:
- The current state of the data center industry
- The pressures of rising data processing demands and energy consumption
- The shift toward sustainable, eco-friendly operations
- AIRSYS’ revolutionary liquid cooling technology, which is equipped to address the major power demand and heat loads brought on by AI
Quigley previews his DCW 2025 presentation in a discussion with JSA CEO and Founder Jaymie Scotto Cutaia on JSA TV here. According to Quigley, data center cooling systems are extremely energy-intensive, accounting for 30 to 55 percent of a facility’s overall energy consumption. Data center operators can lower total cost of ownership by as much as 40 percent by deploying liquid cooling solutions, a savings realized through decreased energy consumption, reduced maintenance requirements, and minimized future capital expenditures.
At DCW 2025, AIRSYS will be discussing their innovative cooling solutions, including its LiquidRack™ technology, designed to meet the growing demands of modern data center cooling. LiquidRack uses liquid cooling to enhance energy efficiency, optimize cooling performance, and maximize computing power without expanding data center footprint or increasing energy consumption.
AIRSYS’ patented cooling system is the world’s first spray Direct to Chip (DTC) liquid cooling solution that offers 100 percent heat recovery, capturing waste heat as usable hot water. Its specialized technology is set to meet and exceed the cooling demands of high-density, technical-driven workloads.
Quigley also plans to showcase AIRSYS’ state-of-the-art facility during his DCW 2025 presentation. The massive manufacturing site, which is now under construction in Woodruff, South Carolina and slated to open in Q1 of 2026, can fit four Boeing 747s end-to-end. The facility will feature the world’s largest liquid cooling 3D printer factory, which makes customized liquid cooling solutions fast and affordable and guarantees precision design customized to each server board. AIRSYS’ made-in-the-USA manufacturing methodology means fast speed of delivery, quality control, and zero tariff and transit disruption risks for data center operators.
Join Paul Quigley, President of AIRSYS Cooling Technologies, at Data Center World 2025 in Washington, D.C. to learn more. His presentation, “Transforming Data Centers for AI — Without More Space or Power,” takes place on Wednesday, April 16 at 11:10 am. Visit AIRSYS at Booth #627 at DCW 2025.
Watch a preview of Quigley’s DCW 2025 presentation on JSA TV below.
